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Current Boards:
The PICMG 3.0 Advanced Telecommunications Architecture (ATCA) standard was designed from ground-up for high availability (redundant power supplies, shelf management of temperatures and fans …) and scalability.
The ATCA base specifications define Shelves (sub-rack), Boards (SBC, IO, Hub/switching, Mezzanines Carrier), Mezzanines (AMC, PMC) and Management interface sharing a common backplane with interconnections based on a full mesh of serial gigabit communication links.
Each slot can be interconnected to all others through x1, x2 and x4 links with a maximum throughput capacity of 800 MByte/s. By choosing the correct links, it is possible to have more than one controller on the ATCA shelf, each controlling a set of ATCA digitizer modules.
The ATCA redundancy scheme permits to have two equal sets of cards installed on the shelf and in case of failure of the operating set, the second one can take over its functions. ATCA is also capable of hot-plugging of cards thus allowing continuous operation and maintenance.
Supported communications protocols are the Advanced Switching Interconnect (ASI), PCI Express (PCIe), Gigabit Ethernet (GbE), Serial RapidIO (SRIO), Infiniband or other PICMG 3 compliant standards. Each slot is interconnected to all others through x1, x2 or x4 links with a maximum real throughput capacity of ~800 MByte/s (10 Gbit/s per link – 25 Gbit/s per link supported).
Additional ATCA related specifications:
File | Size | Date | Attached by | |||
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atca_ha.png No description | 756.65 kB | 20:04, 26 Mar 2014 | jsousa | Actions | ||
atca_sites.png No description | 694.62 kB | 19:52, 26 Mar 2014 | jsousa | Actions |